Transistor and method thereof

1. An electronic device comprising:

a first well region of a first conductivity-type;

a second well region of a second conductivity-type abutting the first well region at a first interface, from a top view the first interface generally extends in a first direction, the first conductivity-type and the second conductivity type being opposite conductivity types;

an insulator region extending into the first well region, wherein the insulator region and the first well region abut and define a second interface, and, from a top view, the insulator region includes a first feature extending toward the first interface, and the insulator region defines a first space bounded by the first feature, wherein a dimension from a portion of the first feature closest to the first interface is at least zero, and wherein a portion of the insulator region closest to the first interface is less than about 0.2 um from the first interface; and

a transistor gate structure overlying the first interface.

2. The device of claim 1 , wherein, from a top view, the second interface is contained within a perimeter of the gate structure.

3. The device of claim 1 further comprising:

a drain region of the transistor having the first conductivity type, and being electrically connected to the first well region, wherein the insulator region is between the drain region and the first interface.

4. The device of claim 3 further comprising:

a source region of the transistor having the first conductivity type, the first interface being between the source region and the insulator region.

5. The device of claim 1 , wherein a portion of the insulator region closest to the first interface is less than twice a misalignment tolerance from the first interface.

6. The device of claim 1 , wherein the first feature is an orthogonal rectilinear feature, a trapezoidal rectilinear feature, or a triangular rectilinear feature.

7. An electronic device comprising:

a first well region of a first conductivity-types

a second well region of a second conductivity-type abutting the first well region at a first interface, from a top view the first interface generally extends in a first direction, the first conductivity-type and the second conductivity type being opposite conductivity types;

an insulator region extending into the first well region, wherein the insulator region and the first well region abut and define a second interface, and, from a top view, the insulator region includes a first feature extending toward the first interface, and the insulator region defines a first space bounded by the first feature, wherein a dimension from a portion of the first feature closest to the first interface is at least zero, and a ratio of the width of the first space to a width of the first feature is greater than approximately 0.25; and

a transistor gate structure overlying the first interface.

8. The device of claim 7 , wherein the ratio is less than approximately 1.7.

9. The device of claim 7 , wherein a ratio of the width of the first feature to a length of a channel of the transistor is less than approximately 1.

10. The device of claim 7 , wherein a ratio of the width of the first feature to a length of the first feature is greater than approximately 0.5.

11. The device of claim 10 , wherein the ratio of the width of the first feature to the length of the first feature is less than approximately 2.0.

12. The device of claim 1 , wherein the insulator region includes a plurality of features, including the first feature and a second feature, that define a plurality of spaces including the first space and a second space, wherein the first space is between the first feature and the second feature, and the second feature is between the first space and the second space.

13. The device of claim 12 , wherein each feature of the plurality of features is a rectilinear feature.

14. A process of forming an electronic device comprising:

providing a substrate comprising a first well region of a first conductivity-type abutting a second well region of a second conductivity-type at a first interface, from a top view the first interface generally extends in a first direction, the first conductivity-type and the second conductivity type being opposite conductivity types;

forming an insulator region extending into the first well region, wherein the insulator region and the first well region abut and define a second interface region, and, from a top view, the insulator region includes a first feature extending toward the first interface region, and the insulator region defines a first space bounded by the first feature, wherein a dimension from a portion of the first feature closest to the first interface is at least zero, and wherein a portion of the insulator region closest to the first interface is less than about 0.2 um from the first interface; and

forming a transistor gate structure overlying the first interface.

15. The process of claim 14 , wherein, from a top view, the second interface is contained within a perimeter of the gate structure.

16. The process of claim 14 further comprising:

forming a drain region of the transistor having a first conductivity type, and being electrically connected to the first well region, wherein the insulator region is between the drain region and the first interface; and

forming a source region of the transistor having the first conductivity type, the first interface being between the source region and the insulator region.

17. The process of claim 14 , wherein portion of the insulator region closest to the first interface is less than approximately twice a misalignment tolerance from the first interface.