Granted Patent B2

US 7,816,930 · App. 11/871,716 · Granted Oct 19, 2010

Abstract

Claims (28)

1. An electrical circuit testing assembly comprising:

a testing circuitry support structure having testing circuitry;

a probe support structure that includes at least one electrical probe;

a mechanical intermediating structure that is structured to permit the testing circuitry support structure to move relative to the probe support structure; and

a flexible electrical intermediating structure that permits electrical communication between the probe support structure and the testing circuitry support structure even though the probe support structure is free to move relative to the testing circuitry support structure, at least within a certain range, wherein the mechanical intermediating structure permits the testing circuit support structure to move relative to the probe support structure while supporting the testing circuitry support structure, and while maintaining electrical connection between the probe support structure and the testing circuitry support structure.

2. An electrical circuit testing assembly in accordance with claim 1 , wherein the testing circuitry support structure includes a printed circuit board.

3. An electrical circuit testing assembly in accordance with claim 2 , wherein the printed circuit board has a hole formed therein, the mechanism intermediating structure further comprising:

a mechanical reference;

a printed circuit board holding structure rigidly attached to the mechanical reference and but non-rigidly holding the printed circuit board support; and

a thermal mitigation column coupling the mechanical reference to the probe support structure through the hole in the printed circuit board, wherein the thermal mitigation column is not rigidly attached to the printed circuit board.

4. An electrical circuit testing assembly in accordance with claim 3 , wherein the probe support structure comprising a ring-shaped array of inwardly facing cantilever probes.

5. An electrical circuit testing assembly in accordance with claim 1 , wherein the mechanical intermediating structure comprises:

a mechanical reference; and

a thermal mitigation column coupling the mechanical reference to the probe support structure.

6. An electrical circuit testing assembly in accordance with claim 5 , wherein the thermal mitigation column provides high levels of thermal isolation between the mechanical reference and the probe support structure.

7. An electric circuit testing assembly in accordance with claim 6 , wherein the thermal mitigation column is hollow.

8. An electrical circuit testing assembly in accordance with claim 6 , wherein the thermal mitigation column is composed of ceramic or quartz.

9. An electrical testing assembly in accordance with claim 6 , wherein the thermal mitigation column is composed of a low thermal conducting material.

10. An electrical circuit in accordance with claim 5 , wherein the thermal mitigation column passes through a hole in the testing circuitry support structure such that the mechanical reference is on one side of the testing circuitry support structure while the probe support structure is on the other side of the testing circuitry support structure.

11. An electrical circuit in accordance with claim 10 , wherein the hole in the testing circuit support structure is larger than the cross section at the testing circuit support structure of the thermal mitigation column that passes through the testing circuit support structure, and wherein the testing circuit support structure is not rigidly attached to the thermal mitigation column.

12. An electrical circuitry testing assembly in accordance with claim 5 , wherein the mechanical intermediating structure further comprises:

a testing circuitry support structure intermediating structure rigidly attached to the mechanical reference and configured to non-rigidly receive a testing circuit support structure such that the at least one electrical probe may be electrically connected to testing circuitry within the testing circuitry support structure.

13. An electrical circuit testing assembly in accordance with claim 12 , wherein the testing circuitry support structure intermediating structure further comprises:

a non-rigid securing mechanism configured to secure the testing circuitry support structure within the testing circuitry support structure intermediating structure while permitting the testing circuitry support structure to move within a certain range with respect to the testing circuitry support structure.

14. An electrical circuit testing assembly in accordance with claim 12 , wherein the thermal mitigation column is structured to provide sufficient thermal isolation between the mechanical reference and the probe support mechanism such that if 1) the mechanical reference is fixed with respect to an interconnect pad of size 50 microns or less of a circuit under test, and 2) the probe is in mechanical contact with the interconnect pad, and 3) the temperature is permitted to vary and over a range of 200 degrees C., then the probe maintains mechanical and electrical contact with the interconnect pad.

15. An electrical circuit testing assembly in accordance with claim 14 , wherein the testing circuitry support structure is received into the testing circuitry support structure intermediating structure.

16. An electrical circuit testing assembly in accordance with claim 12 , wherein the thermal mitigation column is composed of quartz or materials that in combination have less than twice the thermal conductivity of quartz.

17. The electrical circuitry testing assembly in accordance with claim 1 , wherein the mechanical intermediating structure is structured to be non-rigidly coupled to the testing circuitry support structure to allow movement of the testing circuitry support structure with respect to the mechanical intermediating structure, at least within a certain range of movement.

Assignments (9)