IP Library Granted Patent US 7,638,405
Granted Patent B2
US 7,638,405 · App. 11/925,017 · Granted Dec 29, 2009

High voltage sensor device

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Quick Facts
Patent No.
US 7,638,405
App. No.
11/925,017
Granted
Dec 29, 2009
Kind
B2
Abstract

In one embodiment, a high voltage element is formed overlying a doped semiconductor region that can be depleted during the operation of the high voltage element.

Claims (21)

1. A method of sensing a high voltage comprising:

providing a semiconductor substrate;

forming a doped region on the semiconductor substrate;

forming a sense element overlying a portion of the semiconductor substrate and overlying a portion of the doped region; and

configuring the sense element to receive a high voltage having a value that is greater than approximately forty volts and responsively form a sense signal having a value that is representative of the value of the high voltage and varies in a continuous manner over an operating range of the value of the high voltage wherein a first terminal of the sense element is not coupled to the doped region.

2. The method of claim 1 wherein forming the sense element includes forming a resistor that receives the high voltage on the first terminal and forms the sense signal on a second terminal of the resistor.

3. The method of claim 1 wherein forming the sense element overlying the portion of the semiconductor substrate includes forming a insulator overlying a portion of the doped region and forming the sense element overlying a portion of the insulator.

4. The method of claim 3 wherein forming the insulator includes forming the sense element overlying a portion of a transistor.

5. The method of claim 1 wherein forming the sense element includes forming the sense element overlying a portion of a J-FET.

6. The method of claim 1 wherein forming the sense element overlying the portion of the semiconductor substrate includes configuring the sense element to receive the high voltage that is greater than one hundred volts.

7. The method of claim 1 wherein forming the sense element overlying the portion of the semiconductor substrate includes configuring the sense element to receive the high voltage that is greater than four hundred volts.

8. The method of claim 1 wherein configuring the sense element to receive the high voltage having the value that is greater than approximately forty volts and responsively form the sense signal includes configuring the sense element to form one of a voltage having a value that is representative of the high voltage or a current having a value that is representative of the high voltage.

9. A method of sensing a high voltage comprising:

providing a semiconductor substrate;

forming a doped region on the semiconductor substrate;

forming a sense element overlying at least a portion of the doped region; and

configuring the sense element to receive a high voltage having a value that is greater than approximately forty volts and responsively form a sense signal having a value is representative of the value of the high voltage wherein one terminal of the sense element is not connected to the doped region.

10. The method of claim 9 further including configuring the sense element to form the sense signal to vary in a continuous manner over an operating range of the value of the high voltage.

11. The method of claim 9 further including forming an insulator overlying the doped region and positioned between a resistor and the doped region.

12. The method of claim 9 wherein forming the doped region includes forming the doped region as a portion of a JFET.

13. The method of claim 9 further including coupling a circuit to receive the high voltage commonly with the sense element and responsively provide a current.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →