IP Library Granted Patent US 8,139,408
Granted Patent B2
US 8,139,408 · App. 12/050,491 · Granted Mar 20, 2012

Scalable electrically eraseable and programmable memory

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Quick Facts
Patent No.
US 8,139,408
App. No.
12/050,491
Granted
Mar 20, 2012
Kind
B2
Abstract

A non-volatile memory including one or more EEPROM cell pairs. Each EEPROM cell pair includes three transistors and stores two data bits, effectively providing a 1.5 transistor EEPROM cell. An EEPROM cell pair includes a first non-volatile memory transistor, a second non-volatile memory transistor and a source access transistor. The source access transistor includes: a first source region continuous with a source region of the first non-volatile memory transistor; a second source region continuous with a source region of the second non-volatile memory transistor, and a third source region continuous with source regions of other non-volatile memory transistors located in the same row as the EEPROM cell pair.

Claims (35)

1. A non-volatile memory array comprising:

one or more electrically erasable and programmable memory (EEPROM) cell pairs, each configured to store two data bits, and including:

a first non-volatile memory transistor having a floating gate structure separated from a control gate structure by an inter-gate dielectric layer;

a second non-volatile memory transistor having a floating gate structure separated from a control gate structure by an inter-gate dielectric layer; and

a source access transistor having a floating gate structure electrically connected with a control gate structure, the source access transistor located in a first well region and having a first diffusion region continuous with a source of the first non-volatile memory transistor, and having a second diffusion region continuous with a source of the second non-volatile memory transistor, wherein first well region is located in a second well region.

2. The non-volatile memory array of claim 1 , further comprising a tunnel gate dielectric layer separating the floating gate structures of the first non-volatile memory transistor, the second non-volatile memory transistor and the source access transistor from the first well region.

3. The non-volatile memory array of claim 1 , further comprising a bit line coupled to a drain of the first non-volatile memory transistor and a drain of the second non-volatile memory transistor.

4. The non-volatile memory array of claim 1 , further comprising:

a first word line coupled to the control gate structure of the first non-volatile memory transistor; and

a second word line coupled to the control gate structure of the second non-volatile memory transistor; and

a source select line coupled to the control gate structure of the source access transistor.

5. The non-volatile memory array of claim 4 , wherein the first word line, the second word line and the source select line extend in parallel along a first axis.

6. The non-volatile memory array of claim 1 , wherein the only transistors in each EEPROM cell pair are the first non-volatile memory transistor, the second non-volatile memory transistor and the source access transistor.

7. A non-volatile memory array comprising:

one or more electrically erasable and programmable memory (EEPROM) cell pairs, each configured to store two data bits, and including:

a first non-volatile memory transistor having a floating gate structure separated from a control gate structure by an inter-gate dielectric layer;

a second non-volatile memory transistor having a floating gate structure separated from a control gate structure by an inter-gate dielectric layer; and

a source access transistor having a floating gate structure electrically connected with a control gate structure, the source access transistor located in a first well region and coupled to a source of the first non-volatile memory transistor and a source of the second non-volatile memory transistor, wherein first well region is located in a second well region,

wherein the one or more electrically erasable and programmable memory (EEPROM) cell pairs are arranged in a plurality of rows and columns, wherein a first one of said columns is configured such that the first non-volatile memory transistor and the second non-volatile memory transistor of each EEPROM cell pair in the first one of said columns are in a permanently conductive state.

8. The non-volatile memory array of claim 1 , further comprising an inter-gate dielectric layer located between portions of the floating gate structure of the source access transistor and the control gate structure of the source access transistor.

9. The non-volatile memory array of claim 1 , wherein the floating gate structure of the source access transistor is continuous along an entire row of the non-volatile memory array.

10. A non-volatile memory array comprising:

a first row comprising a first plurality of non-volatile memory transistors;

a second row comprising a second plurality of non-volatile memory transistors;

a plurality of source access transistors, each having a first diffusion region continuous with a source region of a corresponding one of the first plurality of non-volatile memory transistors in the first row, and each having a second diffusion region continuous with a source region of a corresponding one of the second plurality of non-volatile memory transistors in the second row, wherein the plurality of source access transistors comprise a floating gate structure and a control gate structure, wherein the floating gate structure is electrically connected to the control gate structure.

11. The non-volatile memory array of claim 10 , wherein the floating gate structure is continuous along the plurality of source access transistors.

12. The non-volatile memory array of claim 10 , further comprising an inter-gate dielectric layer located between portions of the floating gate structure and the control gate structure.

13. The non-volatile memory array of claim 10 , wherein the first plurality of non-volatile memory transistors includes a first plurality of floating gate structures, and the second plurality of non-volatile memory transistors includes a second plurality of floating gate structures, wherein a tunnel gate dielectric layer is located below the floating gate structures of the first and second pluralities of non-volatile memory transistors and the floating gate structure of the source access transistors.

14. The non-volatile memory array of claim 10 , wherein the plurality of source access transistors are located in a first well region, wherein the first well region is located in a second well region.

15. A non-volatile memory array comprising:

a first row comprising a first plurality of non-volatile memory transistors;

a second row comprising a second plurality of non-volatile memory transistors;

a plurality of source access transistors, each coupled to a source region of a corresponding one of the first plurality of non volatile memory transistors in the first row, and each coupled to a source region of a corresponding one of the second plurality of non-volatile memory transistors in the second row, wherein the plurality of source access transistors comprise a floating gate structure and a control gate structure, wherein the floating gate structure is electrically connected to the control gate structure, and wherein the first plurality of non-volatile memory transistors includes a first permanently conductive non-volatile memory transistor located at a first end of the first row.

16. The non-volatile memory array of claim 15 , wherein the second plurality of non-volatile memory transistors includes a second permanently conductive non-volatile memory transistor located at a first end of the second row, adjacent to the first permanently conductive non-volatile memory transistor.

17. The non-volatile memory array of claim 15 , wherein the first plurality of non-volatile memory transistors further includes a third permanently conductive non-volatile memory transistor located at a second end of the first row, and the second plurality of non-volatile memory transistors includes a fourth permanently conductive non-volatile memory transistor located at a second end of the second row, adjacent to the third permanently conductive non-volatile memory transistor.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
MERGER Recorded Sep 3, 2009
From: CATALYST SEMICONDUCTOR, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
Reel/Frame 023180/0479 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: CATALYST SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 021744/0171 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2008
From: GEORGESCU, SORIN S.; COSMIN, PETER; SMARANDOIU, GEORGE
To: CATALYST SEMICONDUCTOR, INC.
Reel/Frame 020667/0656 →