Patent Assignment
Reel/Frame 033270/0213
Assignment of Assignor's Interest
Recorded: 2014-07-09
Pages: 6
Assignors
CHUNG, HYUNSOO
Executed: 2014-06-17
BAEK, SEUNGDUK
Executed: 2014-06-17
LEE, IN-YOUNG
Executed: 2014-06-17
CHO, TAE-JE
Executed: 2014-06-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same