IP Library › Assignment 033713/0393
Patent Assignment
Reel/Frame 033713/0393

Assignment of Assignor's Interest

Recorded: 2014-09-10 Pages: 7
Assignors
UMENO, KAZUYUKI
Executed: 2014-09-04
SHINAGAWA, TATSUYUKI
Executed: 2014-09-04
TAKAKI, KEISHI
Executed: 2014-09-04
TAMURA, RYOSUKE
Executed: 2014-09-04
OOTOMO, SHINYA
Executed: 2014-09-04
Assignees
FURUKAWA ELECTRIC CO., LTD.
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8322, JAPAN
FUJI ELECTRIC CO., LTD.
1-1, TANABESHINDEN, KAWASAKI-KU, KAWASAKI-SHI, 210-9530, JAPAN
Covered Property (1)
Semiconductor Multi-Layer Substrate, Semiconductor Device, and Method for Manufacturing the Same
Patent: 9,653,589 →
Application: 14/482,636 →
Publication: US 2014/0374771
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Sep 17, 2024
From: FURUKAWA ELECTRIC CO., LTD.
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 068606/0107 →