IP Library › Assignment 033777/0062
Patent Assignment
Reel/Frame 033777/0062

Assignment of Assignor's Interest

Recorded: 2014-09-19 Pages: 4
Assignors
DZIURA, THADDEUS GERARD
Executed: 2014-08-15
PANDEV, STILIAN IVANOV
Executed: 2014-08-15
KUZNETSOV, ALEXANDER
Executed: 2014-08-25
SHCHEGROV, ANDREI V.
Executed: 2014-08-15
Assignee
KLA-TENCOR CORPORATION
ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Properties (3)
Methods and Apparatus for Patterned Wafer Characterization
Application: 14/449,646 →
Publication: US 2015/0046121
Method of Patterned Wafer Characterization
Application: 61/862,801 →
Method of Patterned Wafer Characterization
Application: 61/943,098 →