IP Library › Assignment 034024/0047
Patent Assignment
Reel/Frame 034024/0047

Assignment of Assignor's Interest

Recorded: 2014-10-23 Pages: 5
Assignors
KIM, JIN SEONG
Executed: 2014-10-22
AHN, YE SUL
Executed: 2014-10-22
SONG, CHA GYU
Executed: 2014-10-22
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property (1)
Semiconductor Device with Embedded Semiconductor Die and Substrate-to-Substrate Interconnects
Patent: 9,502,392 →
Application: 14/522,572 →
Publication: US 2015/0108643
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →