Patent Assignment
Reel/Frame 034054/0930
Assignment of Assignor's Interest
Recorded: 2014-10-28
Pages: 6
Assignors
RIDEAU, DENIS
Executed: 2014-10-15
BAYLAC, ELISE
Executed: 2014-10-16
JOSSE, EMMANUEL
Executed: 2014-10-15
MORIN, PIERRE
Executed: 2014-10-15
NIER, OLIVIER
Executed: 2014-10-15
Assignees
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, 92120, FRANCE
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, 38926, FRANCE
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300, COPPELL, TEXAS, 75019
Covered Property
(1)
Method of Forming Stressed Semiconductor Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061915/0364 →
Assignment of Assignor's Interest
Apr 10, 2023
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063276/0569 →
Assignment of Assignor's Interest
Apr 10, 2023
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063277/0222 →