IP Library › Assignment 034068/0598
Patent Assignment
Reel/Frame 034068/0598

Assignment of Assignor's Interest

Recorded: 2014-10-28 Pages: 4
Assignors
PAEK, JONG SIK
Executed: 2014-10-22
PARK, DOO HYUN
Executed: 2014-10-22
Assignee
AMKOR TECHNOLOGY INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property (1)
Semiconductor Device with Reduced Thickness
Patent: 9,418,922 →
Application: 14/524,443 →
Publication: US 2015/0221586
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →