IP Library Assignment 034142/0011
Patent Assignment
Reel/Frame 034142/0011

Assignment of Assignor's Interest

Recorded: 2014-11-11 Pages: 3
Assignors
LEE, SANG-HYUN
Executed: 2014-10-29
NAJAFI, KHALIL
Executed: 2014-10-23
Assignee
THE REGENTS OF THE UNIVERSITY OF MICHIGAN
1214 S. UNIVERSITY, 2ND FLOOR, ANN ARBOR, MICHIGAN, 48104-2592
Covered Property (1)
Environment-Resistant Module, Micropackage and Methods of Manufacturing Same
Application: 14/251,972 →
Publication: US 2016/0159641
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 11, 2014
From: LEE, SANG WOO; MITCHELL, JAY STEWART; SRIVANNAVIT, ONNOP
To: E-PACK, INC.
Reel/Frame 034203/0974 →
Nunc Pro Tunc Assignment Jul 15, 2021
From: EPACK, INC.
To: BLILEY TECHNOLOGIES, INC.
Reel/Frame 056889/0599 →
Assignment of Assignor's Interest Jan 14, 2025
From: BLILEY TECHNOLOGIES, INC.
To: KYOCERA AVX COMPONENTS (ERIE) CORPORATION
Reel/Frame 069850/0897 →