Patent Assignment
Reel/Frame 034203/0974
Assignment of Assignor's Interest
Recorded: 2014-11-11
Pages: 3
Assignors
LEE, SANG WOO
Executed: 2014-09-09
MITCHELL, JAY STEWART
Executed: 2014-09-09
SRIVANNAVIT, ONNOP
Executed: 2014-09-09
Assignee
E-PACK, INC.
333 PARKLAND PLAZA, ANN ARBOR, MICHIGAN, 48103
Covered Property
(1)
Environment-Resistant Module, Micropackage and Methods of Manufacturing Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 11, 2014
From: LEE, SANG-HYUN; NAJAFI, KHALIL
To: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
Reel/Frame 034142/0011 →
Nunc Pro Tunc Assignment
Jul 15, 2021
From: EPACK, INC.
To: BLILEY TECHNOLOGIES, INC.
Reel/Frame 056889/0599 →
Assignment of Assignor's Interest
Jan 14, 2025
From: BLILEY TECHNOLOGIES, INC.
To: KYOCERA AVX COMPONENTS (ERIE) CORPORATION
Reel/Frame 069850/0897 →