IP Library › Assignment 056889/0599
Patent Assignment
Reel/Frame 056889/0599

Nunc Pro Tunc Assignment

Recorded: 2021-07-15 Pages: 27
Assignor
EPACK, INC.
Executed: 2021-06-16
Assignee
BLILEY TECHNOLOGIES, INC.
2545 WEST GRANDVIEW BLVD, ERIE, PENNSYLVANIA, 16506
Covered Properties (10)
Space-Efficient Planar Interposer for Environment-Resistant Packaging
Application: 62/626,767 →
Space-Efficient Planar Interposer for Environment-Resistant Packaging
Application: 16/268,636 →
Publication: US 2019/0241428
Vibration Isolator Platform with Electronic Acceleration Compensation
Application: 62/632,591 →
Vibration Isolator Platform with Electronic Acceleration Compensation
Application: 16/279,030 →
Publication: US 2019/0256348
System with Oven Control and Compensation for Detecting Motion and/or Orientation
Application: 14/925,349 →
Publication: US 2017/0122976
Mems Isolation Platform with Three-Dimensional Vibration and Stress Isolation
Application: 15/393,542 →
Publication: US 2018/0230005
Environment-Resistant Module, Micropackage and Methods of Manufacturing Same
Patent: 8,049,326 →
Application: 12/135,532 →
Publication: US 2009/0085191
Environment-Resistant Module, Micropackage and Methods of Manufacturing Same
Patent: 8,476,737 →
Application: 13/273,402 →
Publication: US 2012/0032346
Environment-Resistant Module, Micropackage and Methods of Manufacturing Same
Patent: 8,698,292 →
Application: 13/930,699 →
Publication: US 2013/0285171
Environment-Resistant Module, Micropackage and Methods of Manufacturing Same
Application: 14/251,972 →
Publication: US 2016/0159641
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 26, 2008
From: NAJAFI, KHALIL; LEE, SANG-HYUN; LEE, SANG WOO
To: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
Reel/Frame 021153/0232 →
Assignment of Assignor's Interest Nov 11, 2014
From: LEE, SANG WOO; MITCHELL, JAY STEWART; SRIVANNAVIT, ONNOP
To: E-PACK, INC.
Reel/Frame 034203/0974 →
Assignment of Assignor's Interest Nov 11, 2014
From: LEE, SANG-HYUN; NAJAFI, KHALIL
To: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
Reel/Frame 034142/0011 →
Assignment of Assignor's Interest Oct 28, 2015
From: MITCHELL, JAY; CHALLONER, ANTHONY; LEE, SANGWOO
To: EPACK, INC.
Reel/Frame 036905/0158 →
Assignment of Assignor's Interest Dec 29, 2016
From: LEE, SANGWOO; MITCHELL, JAY; SRIVANNAVIT, ONNOP
To: EPACK, INC.
Reel/Frame 040800/0883 →
Assignment of Assignor's Interest Apr 11, 2018
From: MITCHELL, JAY; SRINANNAVIT, ONNOP; LEMMERHIRT, DAVID
To: EPACK, INC.
Reel/Frame 045507/0228 →
Assignment of Assignor's Interest Apr 24, 2018
From: MITCHELL, JAY; SRINANNAVIT, ONNOP; LEMMERHIRT, DAVID
To: EPACK, INC.
Reel/Frame 045618/0302 →
Assignment of Assignor's Interest Mar 25, 2019
From: MITCHELL, JAY; LEMMERHIRT, DAVID; SRIVANNAVIT, ONNOP
To: EPACK, INC.
Reel/Frame 048683/0128 →
Assignment of Assignor's Interest Mar 28, 2019
From: MITCHELL, JAY; LEMMERHIRT, DAVID; SRIVANNAVIT, ONNOP
To: EPACK, INC.
Reel/Frame 048725/0637 →
Confirmatory License Jun 17, 2019
From: E-PACK
To: NAVY, SECRETARY OF THE UNITED STATES OF AMERICA
Reel/Frame 049483/0777 →
Assignment of Assignor's Interest Jan 14, 2025
From: BLILEY TECHNOLOGIES, INC.
To: KYOCERA AVX COMPONENTS (ERIE) CORPORATION
Reel/Frame 069850/0897 →