Patent Assignment
Reel/Frame 034151/0208
Assignment of Assignor's Interest
Recorded: 2014-11-04
Pages: 14
Assignors
KIM, JAE YUN
Executed: 2014-10-09
LIM, GI TAE
Executed: 2014-10-09
JUNG, WOON KAB
Executed: 2014-11-04
YOON, JU HOON
Executed: 2014-11-04
PARK, DONG JOO
Executed: 2014-10-09
CHO, BYONG WOO
Executed: 2014-10-20
HAN, GYU WAN
Executed: 2014-10-13
CHUNG, JI YOUNG
Executed: 2014-10-22
KIM, JIN SEONG
Executed: 2014-10-13
NA, DO HYUN
Executed: 2014-11-04
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Semiconductor Device with a Semiconductor Die Embedded Between an Extended Substrate and a Bottom Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →