Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
View Patent ↗A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
1. A semiconductor device comprising:
a first substrate comprising a top surface and a bottom surface;
a semiconductor die comprising a top surface and a bottom surface, wherein the bottom surface of the semiconductor die is bonded to the top surface of the first substrate;
a second substrate comprising a top surface and a bottom surface;
an adhering member between the bottom surface of the second substrate and the top surface of the semiconductor die;
at least one conductive bump coupling the bottom surface of the second substrate to the top surface of the first substrate; and
a mold member that encapsulates the semiconductor die and the conductive bump,
wherein a gap between a topmost surface of the mold member and the second substrate is filled with at least a compound other than the adhering member, and other than an underfill compound.
2. The semiconductor device according to claim 1 , wherein a first conductive bump of the at least one conductive bump is directly coupled to a first connecting pad on the first substrate and to a second connecting pad on the second substrate.
3. The semiconductor device according to claim 1 , comprising a terminal on the top surface of the second substrate.
4. The semiconductor device according to claim 3 , wherein a first conductive bump of the at least one conductive bump is electrically connected to the terminal.
5. The semiconductor device according to claim 3 , wherein the second substrate comprises an interposer.
6. The semiconductor device according to claim 1 , wherein:
in a first horizontal portion of the gap, a portion of the adhering member, but none of the compound, is directly vertically between the mold member and the bottom surface of the second substrate; and
in a second horizontal portion of the gap, a portion of the compound, but none of the adhering member, is directly vertically between the mold member and the bottom surface of the second substrate.
7. The semiconductor device according to claim 1 , wherein the adhering member comprises a laminate film.
8. The semiconductor device according to claim 1 , wherein a first conductive bump of the at least one conductive bump comprises a conductive post that is directly coupled to the top surface of the first substrate.
9. The semiconductor device according to claim 8 , wherein the conductive post comprises a copper post.
10. The semiconductor device according to claim 8 , wherein the top surface of the first substrate comprises an uppermost surface of the first substrate, and the conductive post comprises a bottom end that is no lower than the uppermost surface of the first substrate.
11. The semiconductor device according to claim 1 , wherein the adhering member comprises one of: a non-conductive film adhesive and a thermal hardening liquid adhesive.
12. The semiconductor device according to claim 1 , wherein a topmost surface of the mold member is coplanar with a topmost surface of a first conductive bump of the at least one conductive bump.
13. A semiconductor device comprising:
a first substrate comprising a top surface and a bottom surface;
a semiconductor die comprising a top surface and a bottom surface, wherein the bottom surface of the semiconductor die is bonded to the top surface of the first substrate;
a second substrate comprising a top surface and a bottom surface;
an adhering member between the bottom surface of the second substrate and the top surface of the semiconductor die;
a first contact on the top surface of the first substrate;
a second contact on the bottom surface of the second substrate top, wherein the second contact is coupled to the first contact; and
a mold member that encapsulates the semiconductor die and the first contact, and comprises a topmost surface that is coplanar with a top surface of the first contact second contact,
wherein:
there is no direct contact between the topmost surface of the mold member and the second substrate, and
a gap between the topmost surface of the mold member and the second substrate is filled with at least a compound other than the adhering member, and other than an underfill compound.
14. The semiconductor device according to claim 13 , wherein the first contact comprises a conductive post directly on the top surface of the first substrate.
15. The semiconductor device according to claim 14 , wherein the second contact comprises a conductive ball directly on the bottom surface of the second substrate.
16. The semiconductor device according to claim 13 , wherein the first contact comprises a conductive ball and the second contact comprises a conductive post.
17. The semiconductor device according to claim 13 , wherein the first contact comprises a first conductive ball the second contact comprises a second conductive ball.
18. The semiconductor device according to claim 13 , wherein the second substrate comprises an interposer.
19. A method for manufacturing a semiconductor device, the method comprising:
providing a first substrate comprising a top surface and a bottom surface;
providing a semiconductor die comprising a top surface and a bottom surface, wherein the bottom surface of the semiconductor die is bonded to the top surface of the first substrate;
providing a second substrate comprising a top surface and a bottom surface;
providing an adhering member between the bottom surface of the second substrate and the top surface of the semiconductor die;
providing a first contact on the top surface of the substrate;
providing a second contact on the bottom surface of the second substrate, wherein the second contact is coupled to the first contact; and
providing a mold member that encapsulates the semiconductor die and the first contact, and comprises a topmost surface that is coplanar with a top surface of the first contact,
wherein:
there is no direct contact between the topmost surface of the mold member and the second substrate, and
a gap between the topmost surface of the mold member and the second substrate is filled with a least a compound other than the adhering member, and other than an underfill compound.
20. The method according to claim 19 , wherein the first contact comprises a conductive post directly on the top surface of the first substrate.
21. The method according to claim 19 , wherein the topmost surface of the mold member is coplanar with the top surface of the first contact and the top surface of the semiconductor die.