IP Library Assignment 034233/0487
Patent Assignment
Reel/Frame 034233/0487

Release of Security Interest

Recorded: 2014-11-21 Pages: 3
Assignor
COMERICA BANK
Executed: 2014-11-20
Assignee
OEG-TEG, LLC
2120 W. GUADALUPE, GILBERT, ARIZONA, 85233
Covered Properties (5)
High-adhesive backside metallization
Application: 11/863,046 →
Publication: US 2008/0083611
Stress adjustment in reactive sputtering
Patent: 8,808,513 →
Application: 12/411,301 →
Publication: US 2009/0242392
Stress adjustment in reactive sputtering
Patent: 8,691,057 →
Application: 12/411,357 →
Publication: US 2009/0242388
Control of crystal orientation and stress in sputter deposited thin films
Application: 12/411,369 →
Publication: US 2009/0246385
Sputter deposition of cermet resistor films with low temperature coefficient of resistance
Application: 61/180,884 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Mar 14, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038083/0231 →
Change of Name Mar 31, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038321/0698 →
Security Interest Apr 5, 2016
From: OEM GROUP, LLC
To: THL CORPORATE FINANCE, INC., AS COLLATERAL AGENT
Reel/Frame 038355/0078 →