IP Library › Assignment 034242/0957
Patent Assignment
Reel/Frame 034242/0957

Assignment of Assignor's Interest

Recorded: 2014-11-23 Pages: 6
Assignors
WANG, LEI
Executed: 2014-03-24
GUO, LIPING
Executed: 2014-03-24
WANG, JINSHENG
Executed: 2014-03-24
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, LAW DEPARTMENT, AUSTIN, TEXAS, 78735
Covered Property (1)
Semiconductor Device Having Lead Frame with Notched Inner Leads
Patent: 9,299,645 →
Application: 14/551,075 →
Publication: US 2015/0279765
Related Assignments (11)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to Ip Security Agreement Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0001 →
Supplement to Ip Security Agreement Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0923 →
Supplement to Ip Security Agreement Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035034/0019 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037358/0001 →
Assignment and Assumption of Security Interest in Patents Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0535 →
Assignment and Assumption of Security Interest in Patents Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0444 →
Supplement to the Security Agreement Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Change of Name Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040632 Frame: 0001. Assignor(S) Hereby Confirms the Merger and Change of Name. Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
Assignment of Assignor's Interest Sep 10, 2024
From: NXP USA, INC.
To: CHIP PACKAGING TECHNOLOGIES, LLC
Reel/Frame 068541/0903 →