IP Library › Assignment 034292/0501
Patent Assignment
Reel/Frame 034292/0501

Assignment of Assignor's Interest

Recorded: 2014-12-01 Pages: 6
Assignor
GLOBAL LED SOLUTIONS, LLC
Executed: 2014-11-26
Assignee
INTELLECTUAL DISCOVERY CO., LTD.
10TH FLOOR, GOLDEN TOWER, 511, SAMSUNG-RO, GANGNAM-GU, SEOUL, 135-090, KOREA, REPUBLIC OF
Covered Properties (14)
Heat Dissipating Device Package
Patent: 6,242,800 →
Application: 08/815,814 →
Commonly Housed Diverse Semiconductor Die
Patent: 5,814,884 →
Application: 08/816,829 →
Commonly Housed Diverse Semiconductor Die with Reduced Inductance
Patent: 6,144,093 →
Application: 09/070,097 →
Commonly Housed Diverse Semiconductor Device
Patent: 6,133,632 →
Application: 09/161,790 →
Co-Packaged Mos-Gated Device and Control Integrated Circuit
Patent: 6,184,585 →
Application: 09/191,951 →
Chip Scale Packaging Method
Patent: 6,281,096 →
Application: 09/556,213 →
Surface mount to-220 package and process for the manufacture thereof
Patent: 6,291,262 →
Application: 09/563,358 →
Commonly housed diverse semiconductor die
Patent: 6,297,552 →
Application: 09/645,060 →
Chip Scale Package
Patent: 6,396,091 →
Application: 09/840,439 →
Publication: US 2001/0036695
Five Layer Adhesive/Insulator/Metal/Insulator/Adhesive Tape for Semiconductor Die Packaging
Patent: 6,621,166 →
Application: 09/860,304 →
Publication: US 2001/0042592
Commonly Housed Diverse Semiconductor
Patent: 6,404,050 →
Application: 09/966,092 →
Publication: US 2002/0008319
Contact Structure for Semiconductor Device
Patent: 6,765,292 →
Application: 10/316,249 →
Publication: US 2003/0107130
Five Layer Adhesive/Insulator/Metal/Insulator/Adhesive Tape for Semiconductor Die Packaging
Patent: 6,768,211 →
Application: 10/633,752 →
Publication: US 2004/0026795
Decoupling Circuit for Co-Packaged Semiconductor Devices
Patent: 7,167,043 →
Application: 10/993,951 →
Publication: US 2005/0111157
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 12, 1997
From: MUNOZ, JORGE; KINZER, DANIEL M.; CHEAH, CHUAN
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 008463/0637 →
Assignment of Assignor's Interest Mar 16, 1997
From: DAVIS, CHRISTOPHER; CHEAH, CHUAN; KINZER, DANIEL M.
To: INTERNATIONAL RECTIFIER CORPORATION, A CORP. OF DELAWARE
Reel/Frame 008600/0886 →
Assignment of Assignor's Interest Apr 27, 1998
From: DAVIS, CHRISTOPHER; CONNAH, GLYNN
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 009153/0172 →
Assignment of Assignor's Interest Jan 25, 1999
From: MARTINEZ, ROBERTO; CHEAH, CHUAN
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 009707/0907 →
Security Interest Jul 19, 1999
From: INTERNATIONAL RECTIFIER CORP.
To: BANQUE NATIONALE DE PARIS
Reel/Frame 010070/0701 →
Assignment of Assignor's Interest Jul 24, 2000
From: EWER, PETER R.
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 011003/0576 →
Assignment of Assignor's Interest May 18, 2001
From: KULINSKY, LAWRENCE
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 011841/0375 →
Assignment of Assignor's Interest Dec 10, 2002
From: CHEAH, CHUAN; SHIVKUMAR, BHARAT
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 013562/0795 →
Assignment of Assignor's Interest Jan 10, 2005
From: BAHRAMIAN, TONY
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 016140/0853 →
Release of Security Interest Jun 1, 2012
From: BNP PARIBAS (FORMERLY KNOWN AS BANQUE NATIONALE DE PARIS)
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 028315/0386 →
Assignment of Assignor's Interest Sep 25, 2012
From: INTERNATIONAL RECTIFIER CORPORATION
To: GLOBAL LED SOLUTIONS, LLC
Reel/Frame 029034/0162 →