Patent Assignment
Reel/Frame 034495/0907
Assignment of Assignor's Interest
Recorded: 2014-12-12
Pages: 3
Assignor
YAMAUCHI, AKIRA
Executed: 2014-10-10
Assignee
BONDTECH CO., LTD.
1-25, NISHINOHATA, OKUBO-CHO, UJI-SHI, KYOTO, 611-0033, JAPAN
Covered Property
(1)
Chip-On-Wafer Bonding Method and Bonding Device, and Structure Comprising Chip and Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.