IP Library › Assignment 037199/0879
Patent Assignment
Reel/Frame 037199/0879

Corporate Address Change

Recorded: 2015-12-03 Pages: 2
Assignor
BONDTECH CO., LTD.
Executed: 2015-12-03
Assignee
BONDTECH CO., LTD.
77, ISHIHARANISHIMACHI, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8366, JAPAN
Covered Property (1)
Chip-On-Wafer Bonding Method and Bonding Device, and Structure Comprising Chip and Wafer
Patent: 9,142,532 →
Application: 14/397,038 →
Publication: US 2015/0048523
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 12, 2014
From: YAMAUCHI, AKIRA
To: BONDTECH CO., LTD.
Reel/Frame 034495/0907 →
Change of Address Feb 14, 2025
From: BONDTECH CO., LTD.
To: BONDTECH CO., LTD.
Reel/Frame 070235/0924 →