IP Library › Assignment 070235/0924
Patent Assignment
Reel/Frame 070235/0924

Change of Address

Recorded: 2025-02-14 Pages: 2
Assignor
BONDTECH CO., LTD.
Executed: 2025-02-14
Assignee
BONDTECH CO., LTD.
25, MIYANOHIGASHI-CHO, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8305, JAPAN
Covered Property (1)
Chip-On-Wafer Bonding Method and Bonding Device, and Structure Comprising Chip and Wafer
Patent: 9,142,532 →
Application: 14/397,038 →
Publication: US 2015/0048523
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 12, 2014
From: YAMAUCHI, AKIRA
To: BONDTECH CO., LTD.
Reel/Frame 034495/0907 →
Corporate Address Change Dec 3, 2015
From: BONDTECH CO., LTD.
To: BONDTECH CO., LTD.
Reel/Frame 037199/0879 →