Patent Assignment
Reel/Frame 034812/0047
Assignment of Assignor's Interest
Recorded: 2015-01-26
Pages: 4
Assignors
GUO, DECHAO
Executed: 2015-01-21
LIU, ZUOGUANG
Executed: 2015-01-21
YAMASHITA, TENKO
Executed: 2015-01-21
YEH, CHUN-CHEN
Executed: 2015-01-21
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Silicon Nitride Fill for Pc Gap Regions to Increase Cell Density
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Oct 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061623/0936 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →