Patent Assignment
Reel/Frame 061623/0936
Certificate of Conversion & Change of Name
Recorded: 2022-10-07
Pages: 6
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(7)
Vias in Porous Substrates
Silicon Nitride Fill for Pc Gap Regions to Increase Cell Density
Vias in Porous Substrates
Self Aligned Replacement Metal Source/Drain Finfet
Patent:
9,466,693 →
Application:
14/943,652 →
Self Aligned Replacement Metal Source/Drain Finfet
Silicon Nitride Fill for Pc Gap Regions to Increase Cell Density
Self Aligned Replacement Metal Source/Drain Finfet
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 26, 2015
From: GUO, DECHAO; LIU, ZUOGUANG; YAMASHITA, TENKO; YEH, CHUN-CHEN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 034812/0047 →
Assignment of Assignor's Interest
Oct 27, 2015
From: MOHAMMED, ILYAS; HABA, BELGACEM; UZOH, CYPRIAN; SAVALIA, PIYUSH
To: TESSERA RESEARCH LLC
Reel/Frame 036892/0126 →
Assignment of Assignor's Interest
Oct 28, 2015
From: TESSERA RESEARCH LLC
To: TESSERA, INC.
Reel/Frame 036903/0177 →
Assignment of Assignor's Interest
Nov 17, 2015
From: ALPTEKIN, EMRE; ROBISON, ROBERT R.; VEGA, REINALDO A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 037062/0788 →
Assignment of Assignor's Interest
Apr 22, 2016
From: ALPTEKIN, EMRE; ROBISON, ROBERT R.; VEGA, REINALDO A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038356/0944 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
Nov 7, 2017
From: GUO, DECHAO; LIU, ZUOGUANG; YAMASHITA, TENKO; YEH, CHUN-CHEN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044051/0509 →
Assignment of Assignor's Interest
Jul 2, 2019
From: ALPTEKIN, EMRE; ROBISON, ROBERT R.; VEGA, REINALDO A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 049650/0290 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0324 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Corrective Assignment to Correct the 16/161,111 Previously Recorded on Reel 051489 Frame 0324. Assignor(S) Hereby Confirms the Assignment.
Aug 3, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 053389/0252 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →