IP Library Assignment 034999/0695
Patent Assignment
Reel/Frame 034999/0695

Assignment of Assignor's Interest

Recorded: 2015-02-20 Pages: 3
Assignors
KALENIAN, WILLIAM J.
Executed: 2015-01-26
WALSH, THOMAS A.
Executed: 2015-01-26
Assignee
STRASBAUGH
825 BUCKLEY ROAD, SAN LUIS OBISPO, CALIFORNIA, 93401
Covered Property (1)
Method of Grinding Wafer Stacks to Provide Uniform Residual Silicon Thickness
Patent: 9,082,713 →
Application: 14/525,115 →
Publication: US 2015/0118826
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Mar 7, 2017
From: STRASBAUGH AND R.H. STRASBAUGH
To: BFI BUSINESS FINANCE DBA CAPITALSOURCE BUSINESS FINANCE GROUP
Reel/Frame 041904/0158 →
Assignment of Assignor's Interest Mar 8, 2017
From: BFI BUSINESS FINANCE DBA CAPITALSOURCE BUSINESS FINANCE GROUP
To: REVASUM, INC.
Reel/Frame 041909/0687 →
Security Interest Dec 12, 2023
From: REVASUM, INC.
To: SQN VENTURE INCOME FUND II, LP
Reel/Frame 065849/0798 →
Security Interest Feb 23, 2024
From: REVASUM, INC.
To: SQN VENTURE INCOME FUND II, LP
Reel/Frame 066545/0924 →