Patent Assignment
Reel/Frame 035181/0001
Assignment of Assignor's Interest
Recorded: 2015-03-17
Pages: 4
Assignors
LEE, HUN TEAK
Executed: 2015-03-17
KIM, YOUNGCHUL
Executed: 2015-03-17
BAE, HYUNIL
Executed: 2015-03-17
LEE, HEESOO
Executed: 2015-03-17
CHI, HEEJO
Executed: 2015-03-17
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Surface Treatment and Method of Manufacture Thereof
Patent:
9,385,100 →
Application:
14/659,905 →
Integrated Circuit Packaging System with Surface Treatment and Method of Manufacture Thereof
Application:
61/969,007 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.