IP Library › Assignment 035622/0727
Patent Assignment
Reel/Frame 035622/0727

Assignment of Assignor's Interest

Recorded: 2015-05-12 Pages: 3
Assignors
HUANG, CHIH-KUNG
Executed: 2015-05-08
LAI, WEI-JEN
Executed: 2015-05-08
LIU, WEN-CHUN
Executed: 2015-05-08
Assignee
IBIS INNOTECH INC.
58,CHAOMA 7TH STREET, SITUN DIST.,, TAICHUNG CITY, 40757, TAIWAN
Covered Property (1)
Package Substrate Structure
Patent: 9,451,694 →
Application: 14/663,447 →
Publication: US 2015/0373849
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 30, 2023
From: IBIS INNOTECH INC
To: XIN-RUI ADVANCED MATERIALS CO., LTD.
Reel/Frame 064429/0466 →
Assignment of Assignor's Interest Sep 1, 2025
From: XIN-RUI ADVANCED MATERIALS CO., LTD.
To: VESTA MICROSYSTEM CO., LTD.
Reel/Frame 072127/0807 →