IP Library › Assignment 072127/0807
Patent Assignment
Reel/Frame 072127/0807

Assignment of Assignor's Interest

Recorded: 2025-09-01 Pages: 3
Assignor
Assignee
VESTA MICROSYSTEM CO., LTD.
3 F., NO. 17, GUANGFU N. RD., HUKOU TOWNSHIP,, HSINCHU COUNTY, 303036, TAIWAN
Covered Properties (2)
Package Substrate Structure
Patent: 9,451,694 →
Application: 14/663,447 →
Publication: US 2015/0373849
Package Structure and Manufacturing Method of Package Structure
Application: 15/461,499 →
Publication: US 2017/0194241
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2015
From: HUANG, CHIH-KUNG; LAI, WEI-JEN; LIU, WEN-CHUN
To: IBIS INNOTECH INC.
Reel/Frame 035622/0727 →
Assignment of Assignor's Interest Mar 21, 2017
From: LIU, WEN-CHUN; LAI, WEI-JEN
To: IBIS INNOTECH INC.
Reel/Frame 041669/0996 →
Assignment of Assignor's Interest Jul 30, 2023
From: IBIS INNOTECH INC
To: XIN-RUI ADVANCED MATERIALS CO., LTD.
Reel/Frame 064429/0466 →