IP Library › Assignment 041669/0996
Patent Assignment
Reel/Frame 041669/0996

Assignment of Assignor's Interest

Recorded: 2017-03-21 Pages: 4
Assignors
LIU, WEN-CHUN
Executed: 2017-03-15
LAI, WEI-JEN
Executed: 2017-03-15
Assignee
IBIS INNOTECH INC.
58,CHAOMA 7TH STREET, SITUN DIST.,, TAICHUNG CITY, 40757, TAIWAN
Covered Property (1)
Package Structure and Manufacturing Method of Package Structure
Application: 15/461,499 →
Publication: US 2017/0194241
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 30, 2023
From: IBIS INNOTECH INC
To: XIN-RUI ADVANCED MATERIALS CO., LTD.
Reel/Frame 064429/0466 →
Assignment of Assignor's Interest Sep 1, 2025
From: XIN-RUI ADVANCED MATERIALS CO., LTD.
To: VESTA MICROSYSTEM CO., LTD.
Reel/Frame 072127/0807 →