IP Library › Assignment 064429/0466
Patent Assignment
Reel/Frame 064429/0466

Assignment of Assignor's Interest

Recorded: 2023-07-30 Pages: 3
Assignor
IBIS INNOTECH INC
Executed: 2023-07-24
Assignee
XIN-RUI ADVANCED MATERIALS CO., LTD.
8F.-5, NO. 233, FUXING 2ND RD., AIKOU VIL., ZHUBEI CITY,, HSINCHU COUNTY, 302052, TAIWAN
Covered Properties (2)
Package Substrate Structure
Patent: 9,451,694 →
Application: 14/663,447 →
Publication: US 2015/0373849
Package Structure and Manufacturing Method of Package Structure
Application: 15/461,499 →
Publication: US 2017/0194241
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2015
From: HUANG, CHIH-KUNG; LAI, WEI-JEN; LIU, WEN-CHUN
To: IBIS INNOTECH INC.
Reel/Frame 035622/0727 →
Assignment of Assignor's Interest Mar 21, 2017
From: LIU, WEN-CHUN; LAI, WEI-JEN
To: IBIS INNOTECH INC.
Reel/Frame 041669/0996 →
Assignment of Assignor's Interest Sep 1, 2025
From: XIN-RUI ADVANCED MATERIALS CO., LTD.
To: VESTA MICROSYSTEM CO., LTD.
Reel/Frame 072127/0807 →