IP Library › Assignment 035724/0350
Patent Assignment
Reel/Frame 035724/0350

Assignment of Assignor's Interest

Recorded: 2015-05-27 Pages: 5
Assignors
JUNG, JINHEE
Executed: 2015-05-27
PARK, HYUNGSANG
Executed: 2015-05-27
KIM, SUNGSOO
Executed: 2015-05-27
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property (1)
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure
Patent: 9,837,484 →
Application: 14/722,872 →
Publication: US 2016/0351486
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 26, 2025
From: STATS CHIPPAC, LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 071372/0142 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →