IP Library › Assignment 071372/0142
Patent Assignment
Reel/Frame 071372/0142

Change of Name

Recorded: 2025-05-26 Pages: 3
Assignor
STATS CHIPPAC, LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property (1)
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure
Patent: 9,837,484 →
Application: 14/722,872 →
Publication: US 2016/0351486
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 27, 2015
From: JUNG, JINHEE; PARK, HYUNGSANG; KIM, SUNGSOO
To: STATS CHIPPAC, LTD.
Reel/Frame 035724/0350 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →