Patent Assignment
Reel/Frame 035984/0323
Assignment of Assignor's Interest
Recorded: 2015-06-29
Pages: 8
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System and Method of Manufacture Thereof
Patent:
10,043,733 →
Application:
13/844,179 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.