IP Library › Assignment 039270/0825
Patent Assignment
Reel/Frame 039270/0825

Assignment of Assignor's Interest

Recorded: 2016-07-27 Pages: 5
Assignors
PAGAILA, REZA ARGENTY
Executed: 2008-12-09
DO, BYUNG TAI
Executed: 2008-12-09
CHUA, LINDA PEI EE
Executed: 2008-12-09
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property (1)
Integrated Circuit Packaging System and Method of Manufacture Thereof
Application: 13/844,179 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 29, 2015
From: DO, BYUNG TAI; CHUA, LINDA PEI EE
To: STATS CHIPPAC LTD.
Reel/Frame 035984/0323 →
Change of Name Jul 28, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039503/0660 →