Patent Assignment
Reel/Frame 039503/0660
Change of Name
Recorded: 2016-07-28
Pages: 4
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System and Method of Manufacture Thereof
Patent:
10,043,733 →
Application:
13/844,179 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.