Patent Assignment
Reel/Frame 036107/0079
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 032518 Frame: 0545. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2015-07-15
Pages: 4
Assignor
FANELLI, STEPHEN A.
Executed: 2015-07-13
Assignee
IO SEMICONDUCTOR INCORPORATED
4350 EXECUTIVE DRIVE, SUITE 200, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Bonded Semiconductor Structure with Sigec Layer as Etch Stop
Patent:
9,105,689 →
Application:
14/223,060 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2014
From: FANELLI, STEPHEN A.
To: IO SEMICONDUCTOR, INC.
Reel/Frame 032518/0545 →
Change of Name
Jun 11, 2014
From: IO SEMICONDUCTOR, INC.
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 033134/0338 →
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 033134 Frame: 0338. Assignor(S) Hereby Confirms the Change of Name.
Jul 15, 2015
From: IO SEMICONDUCTOR INCORPORATED
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 036109/0237 →
Change of Name
Oct 16, 2015
From: SILANNA SEMICONDUCTOR U.S.A., INC.
To: QUALCOMM SWITCH CORP.
Reel/Frame 036877/0140 →
Assignment of Assignor's Interest
May 23, 2016
From: QUALCOMM SWITCH CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 038794/0663 →