IP Library › Assignment 036170/0992
Patent Assignment
Reel/Frame 036170/0992

Assignment of Assignor's Interest

Recorded: 2015-07-24 Pages: 3
Assignor
WOOD, THOMAS E.
Executed: 2015-07-22
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property (1)
Semiconductor Wafers with Through Substrate Vias and Back Metal, and Methods of Fabrication Thereof
Patent: 9,666,523 →
Application: 14/808,210 →
Publication: US 2017/0025349
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to the Security Agreement Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Change of Name Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040626 Frame: 0683. Assignor(S) Hereby Confirms the Merger and Change of Name Effective November 7, 2016. Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →