IP Library Assignment 036469/0960
Patent Assignment
Reel/Frame 036469/0960

Change of Name

Recorded: 2015-09-01 Pages: 4
Assignor
ZIPREALTY, INC
Executed: 2014-08-22
Assignee
ZIPREALTY LLC
2000 POWELL STREET, SUITE 300, EMERYVILLE, CALIFORNIA, 95608
Covered Property (1)
Wafer-Scale Production of Chip-Scale Semiconductor Packages Using Wafer Mapping Techniques
Patent: 6,589,801 →
Application: 09/385,694 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →