Patent Assignment
Reel/Frame 036591/0367
Assignment of Assignor's Interest
Recorded: 2015-09-17
Pages: 5
Assignor
SU, WEI-SHUO
Executed: 2015-08-24
Assignees
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO' AN DISTRICT, SHENZHEN, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property
(1)
Method for Manufacturing Package Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 21, 2016
From: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.; FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039806/0505 →
Assignment of Assignor's Interest
Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →