IP Library › Assignment 039806/0505
Patent Assignment
Reel/Frame 039806/0505

Assignment of Assignor's Interest

Recorded: 2016-09-21 Pages: 4
Assignors
ZHEN DING TECHNOLOGY CO., LTD.
Executed: 2016-09-02
Assignees
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Method for Manufacturing Package Structure
Patent: 9,786,589 →
Application: 14/857,020 →
Publication: US 2016/0181181
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2015
From: SU, WEI-SHUO
To: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.; FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 036591/0367 →
Assignment of Assignor's Interest Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →