IP Library › Assignment 037116/0047
Patent Assignment
Reel/Frame 037116/0047

Assignment of Assignor's Interest

Recorded: 2015-11-16 Pages: 5
Assignors
BALOGLU, BORA
Executed: 2015-11-10
ZWENGER, CURTIS
Executed: 2015-11-16
HUEMOELLER, RON
Executed: 2015-11-12
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Encapsulated Semiconductor Package and Method of Manufacturing Thereof
Patent: 9,741,617 →
Application: 14/942,863 →
Publication: US 2017/0140988
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →