Encapsulated semiconductor package and method of manufacturing thereof
View Patent ↗Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.
1. A method of making a semiconductor device, the method comprising:
securing a semiconductor wafer to a carrier, the semiconductor wafer comprising a plurality of semiconductor dies;
while the semiconductor wafer is secured to the carrier, partially dicing the semiconductor wafer;
encapsulating the partially diced semiconductor wafer; and
dicing the encapsulated partially diced semiconductor wafer.
2. The method of claim 1 , wherein said securing a semiconductor wafer to a carrier comprises attaching the semiconductor wafer to a thermal release tape.
3. The method of claim 1 , wherein said partially dicing the semiconductor wafer comprises partially etching the semiconductor wafer.
4. The method of claim 3 , wherein said partially etching the semiconductor wafer comprises:
etching completely through the semiconductor wafer along first portions of a first singulation street; and
refraining from etching the semiconductor wafer along second portions of the first singulation street.
5. The method of claim 1 , wherein said encapsulating the partially diced semiconductor wafer comprises encapsulating the partially diced semiconductor wafer in molding compound.
6. The method of claim 1 , wherein said dicing the encapsulated partially diced semiconductor wafer comprises cutting through wafer material of the partially diced semiconductor wafer and through encapsulant.
7. The method of claim 1 , wherein said dicing the encapsulated partially diced semiconductor wafer comprises forming a cut line that is narrower than an etch line formed during said partially dicing the semiconductor wafer.
8. The method of claim 1 , comprising releasing the encapsulated partially diced semiconductor wafer from the carrier prior to said dicing the encapsulated partially diced semiconductor wafer.
9. A method of making a semiconductor device, the method comprising:
securing a wafer to a carrier, the wafer comprising a plurality of semiconductor dies;
partially dicing the secured wafer by, at least in part, etching completely through the secured wafer along first portions of a singulation street and leaving connectors of wafer material extending between and connecting adjacent dies of the plurality of semiconductor dies along second portions of the singulation street;
encapsulating the partially diced and secured wafer in a molding compound; and
dicing the encapsulated partially diced wafer by, at least in part, sawing completely through the encapsulated partially diced wafer along the entire singulation street.
10. The method of claim 9 , wherein said dicing the encapsulated partially diced wafer comprises forming a cut line along the entirety of the singulation street that is narrower than an etch line formed along the first portions of the singulation street during said partially dicing the secured wafer.
11. The method of claim 9 , wherein said encapsulating comprises covering a top surface of each of the plurality of semiconductor dies and a top surface of each of the connectors of wafer material.
12. The method of claim 11 , wherein the top surface of each of the plurality of semiconductor dies comprises an inactive surface.
13. The method of claim 9 , wherein said dicing the encapsulated partially diced wafer comprises cutting through the connectors and the molding compound.
14. A method of making a semiconductor device, the method comprising:
securing a semiconductor wafer to a carrier, the semiconductor wafer comprising a plurality of semiconductor dies;
while the semiconductor wafer is secured to the carrier, partially dicing the semiconductor wafer, leaving at least one tab of semiconductor wafer material that extends from a first die of the plurality of semiconductor dies to a second die of the plurality of semiconductor dies;
encapsulating the partially diced semiconductor wafer with an encapsulating material; and
dicing the encapsulated partially diced semiconductor wafer.
15. The method of claim 14 , wherein the at least one tab of semiconductor wafer material extends from a middle of a side of the first die to a middle of a side of the second die.
16. The method of claim 14 , wherein the first die and the tab have a same thickness.
17. The method of claim 14 , wherein said encapsulating comprises covering a top side of the first die, a top side of the second die, and a top side of the at least one tab of semiconductor wafer material with the encapsulating material.
18. The method of claim 17 , wherein the top side of the first die is an inactive side.
19. The method of claim 14 , wherein said encapsulating comprises covering lateral sides of the at least one tab of semiconductor wafer material with the encapsulating material.
20. The method of claim 14 , wherein said dicing the encapsulated partially diced semiconductor wafer comprises cutting through the at least one tab of semiconductor wafer material and the encapsulating material.