Patent Assignment
Reel/Frame 037164/0207
Assignment of Assignor's Interest
Recorded: 2015-11-30
Pages: 6
Assignors
WANG, HONGYU
Executed: 2014-07-29
COOK, LEE MELBOURNE
Executed: 2014-07-28
WANG, JIUN-FANG
Executed: 2014-07-30
CHAO, CHING-HSUN
Executed: 2014-07-30
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
Covered Property
(1)
Method for Chemical Mechanical Polishing Substrates Containing Ruthenium and Copper
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →