Patent Assignment
Reel/Frame 037164/0428
Assignment of Assignor's Interest
Recorded: 2015-11-30
Pages: 5
Assignors
QIAN, BAINIAN
Executed: 2014-06-25
DEGROOT, MARTY W.
Executed: 2014-06-24
SONNENSCHEIN, MARK F.
Executed: 2014-06-24
Assignees
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Chemical Mechanical Polishing Layer Formulation with Conditioning Tolerance
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
Assignment of Assignor's Interest
Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
Change of Legal Entity
Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →