Patent Assignment
Reel/Frame 037424/0958
Assignment of Assignor's Interest
Recorded: 2016-01-06
Pages: 6
Assignors
MAUER, LAURA
Executed: 2015-11-10
TADDEI, JOHN
Executed: 2015-11-10
CLARK, JOHN
Executed: 2015-11-10
LAWRENCE, ELENA
Executed: 2015-11-10
ZWIMMANN, ERIC KURT
Executed: 2015-11-10
GOLDBERG, DAVID A.
Executed: 2015-11-10
YUTKOWITZ, JONATHAN
Executed: 2015-11-10
Assignee
VEECO PRECISION SURFACE PROCESSING LLC
185 GIBRALTAR ROAD, HORSHAM, PENNSYLVANIA, 19044
Covered Property
(1)
Method of Etching the Back of a Wafer to Expose Tsvs
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Fifth Inventor's Last Name Previously Recorded at Reel: 037424 Frame: 058. Assignor(S) Hereby Confirms the Assignment.
Jun 21, 2017
From: MAUER, LAURA; TADDEI, JOHN; CLARK, JOHN; LAWRENCE, ELENA
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 043004/0302 →
Assignment of Assignor's Interest
Dec 30, 2019
From: VEECO PRECISION SURFACE PROCESSING LLC
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0549 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →