Patent Assignment
Reel/Frame 051383/0549
Assignment of Assignor's Interest
Recorded: 2019-12-30
Pages: 6
Assignor
VEECO PRECISION SURFACE PROCESSING LLC
Executed: 2019-12-19
Assignee
VEECO INSTRUMENTS INC.
1 TERMINAL DRIVE, PLAINVIEW, NEW YORK, 11803
Covered Properties
(33)
Dispensing Arm Head Having Point of Dispense Recirculation Mode
PCT:
PCT/US2018/058894 ↗
High Pressure Spray Head
PCT:
PCT/US2019/036055 ↗
Apparatus for Supporting and Maneuvering Wafers
PCT:
PCT/US2019/037278 ↗
System and Method for Self-Cleaning Wet Treatment Process
PCT:
PCT/US2019/037961 ↗
An Apparatus and Method for the Minimization of Undercut During a Ubm Etch Process
PCT:
PCT/US2019/038289 ↗
System and Method for Performing a Wet Etching Process
Apparatus and Method to Remove Undissolved Solids from Post Process Dry Film Strip Solvents
Apparatus and Method for Removing Challenging Polymer Films and Structures from Semiconductor Wafers
Apparatus for Dual Speed Spin Chuck
Collection Chamber Apparatus to Separate Multiple Fluids During the Semiconductor Wafer Processing Cycle
System and Method for Flux Coat, Reflow and Clean
Apparatus and Method to Reduce and Control Resistivity of Deionized Water
Apparatus and Method for Metals Free Reduction and Control of Resistivity of Deionized Water
System and Method for Updating an Arm Scan Profile Through a Graoical User Interface
Method of Etching the Back of a Wafer to Expose Tsvs
Apparatus and Method for Mixing Fluids with Degradational Properties
Apparatus and Method to Control Properties of Fluid Discharge Via Refrigerative Exhaust
Apparatus and Method to Control Etch Rate Through Adaptive Spiking of Chemistry
Collection Chamber Apparatus to Separate Multiple Fluids During the Semiconductor Wafer Processing Cycle
Two-level Tape Frame Rinse Assembly
Apparatus and Method to Remove Solids from Material Lift Off Post Process Solvents
Apparatus and Method for Wafer Thinning in Advanced Packaging Applications
Configurable High Temperature Chuck for Use in a Semiconductor Wafer Processing System
Application:
15/960,037 →
Publication:
US 2018/0308741
Semiconductor Wafer Processing Chamber
Two Etch Method for Achieving a Wafer Thickness Profile
Dispensing Arm Head Having Point of Dispense Recirculation Mode
Application:
16/178,934 →
Publication:
US 2019/0139790
Apparatus and Method for Mixing Fluids with Degradational Properties
Application:
16/271,111 →
Publication:
US 2019/0168178
High Pressure Spray Head
Apparatus for Supporting and Maneuvering Wafers
Application:
16/441,873 →
Publication:
US 2019/0385890
System and Method for Self-Cleaning Wet Treatment Process
Apparatus and Method for the Minimization of Undercut During a UBM Etch Process
Semiconductor Wafer Processing Chamber
Application:
16/656,037 →
Publication:
US 2020/0161146
Apparatus and Method for the Minimization of Undercut During a UBM Etch Process
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 30, 2013
From: TADDEI, JOHN; MAUER, LAURA; YOUSSEF, RAMEY; CLARK, JOHN
To: SOLID STATE EQUIPMENT LLC
Reel/Frame 030906/0646 →
Assignment of Assignor's Interest
Aug 15, 2014
From: BREINGAN, WILLIAM GILBERT; ANDERS, JAMES K.; ITZKOWITZ, HERMAN
To: SOLID STATE EQUIPMENT LLC
Reel/Frame 033543/0470 →
Assignment of Assignor's Interest
Sep 24, 2014
From: REGAN, RAY; ITZKOWITZ, HERMAN; BREINGAN, WILLIAM GILBERT
To: SOLID STATE EQUIPMENT LLC
Reel/Frame 033807/0490 →
Assignment of Assignor's Interest
Dec 3, 2014
From: BREINGAN, WILLIAM; RAPOPORT, LEV; CLARK, JOHN; TADDEI, JOHN
To: SOLID STATE EQUIPMENT LLC
Reel/Frame 034364/0881 →
Change of Name
Jul 6, 2015
From: SOLID STATE EQUIPMENT LLC
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 036058/0703 →
Assignment of Assignor's Interest
Nov 4, 2015
From: TADDEI, JOHN; YUTKOWITZ, JONATHAN
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 036962/0088 →
Assignment of Assignor's Interest
Nov 4, 2015
From: TADDEI, JOHN; YUTKOWITZ, JONATHAN
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 036962/0240 →
Assignment of Assignor's Interest
Jan 6, 2016
From: MAUER, LAURA; TADDEI, JOHN; CLARK, JOHN; LAWRENCE, ELENA
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 037424/0958 →
Assignment of Assignor's Interest
Jan 6, 2016
From: GOLDBERG, DAVID A.; YUTKOWITZ, JONATHAN
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 037424/0897 →
Assignment of Assignor's Interest
May 24, 2016
From: TADDEI, JOHN; CLARK, JOHN; YANUZZI, MARK; MAUER, LAURA
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 038700/0015 →
Corrective Assignment to Correct the Third Inventor's Name Previously Recorded at Reel: 038700 Frame: 0015. Assignor(S) Hereby Confirms the Assignment.
Jul 22, 2016
From: TADDEI, JOHN; CLARK, JOHN; YANNUZZI, MARK; MAUER, LAURA
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 039428/0716 →
Assignment of Assignor's Interest
May 31, 2017
From: TADDEI, JOHN; MAUER, LAURA; CHIAVERINI, GEORGE; LI, JIA
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 042548/0264 →
Corrective Assignment to Correct the Fifth Inventor's Last Name Previously Recorded at Reel: 037424 Frame: 058. Assignor(S) Hereby Confirms the Assignment.
Jun 21, 2017
From: MAUER, LAURA; TADDEI, JOHN; CLARK, JOHN; LAWRENCE, ELENA
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 043004/0302 →
Assignment of Assignor's Interest
Jul 3, 2017
From: BREINGAN, WILLIAM GILBERT; HOFMEISTER, CHRIS; TADDEI, JOHN
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 042883/0712 →
Assignment of Assignor's Interest
Oct 2, 2017
From: MAUER, LAURA; TADDEI, JOHN; SWALLOW, JAMES; GOLDBERG, DAVID
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 043757/0360 →
Assignment of Assignor's Interest
May 24, 2018
From: BREINGAN, WILLIAM GILBERT; TADDEI, JOHN; SWALLOW, JAMES
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 045891/0835 →
Assignment of Assignor's Interest
Dec 18, 2018
From: VIT, PAUL; BREINGAN, WILLIAM GILBERT; HOFMEISTER, CHRISTOPHER
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 047801/0816 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →