IP Library › Assignment 037732/0662
Patent Assignment
Reel/Frame 037732/0662

Assignment of Assignor's Interest

Recorded: 2016-02-05 Pages: 7
Assignors
NA, MIN-OK
Executed: 2016-01-15
KIM, JONGKOOK
Executed: 2015-12-22
RYU, HYO-CHANG
Executed: 2015-12-18
PARK, JIN-WOO
Executed: 2015-12-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Thermal Interface Material Layer and Package-on-Package Device Including the Same
Patent: 9,899,294 →
Application: 14/910,280 →
Publication: US 2016/0190035
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Two Inventors Names Omitted Previously Recorded at Reel: 037732 Frame: 0662. Assignor(S) Hereby Confirms the Assignment. Feb 24, 2016
From: NA, MIN-OK; KIM, JONGKOOK; RYU, HYO-CHANG; PARK, JIN-WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 037899/0577 →