Corrective Assignment to Correct the Two Inventors Names Omitted Previously Recorded at Reel: 037732 Frame: 0662. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-02-24 Pages: 8

Assignors

NA, MIN-OK

Executed: 2016-01-15

KIM, JONGKOOK

Executed: 2015-12-22

RYU, HYO-CHANG

Executed: 2015-12-18

PARK, JIN-WOO

Executed: 2015-12-18

SON, BONGJIN

Executed: 2015-12-18

LEE, JANGWOO

Executed: 2015-12-18

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF

Covered Property (1)

Thermal Interface Material Layer and Package-on-Package Device Including the Same

Patent: 9,899,294 →

Application: 14/910,280 →

Publication: US 2016/0190035

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.