Patent Assignment
Reel/Frame 037776/0924
Assignment of Assignor's Interest
Recorded: 2016-02-19
Pages: 7
Assignors
QUAN, JOHNNIE
Executed: 2013-04-03
MILLER, AUGUST
Executed: 2013-04-03
KURT RAAB, KURT RAAB
Executed: 2013-04-03
MIKS, JEFF
Executed: 2013-04-29
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Methods for Temporary Bussing of Semiconductor Package Substrates
Patent:
9,449,890 →
Application:
13/892,118 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →