IP Library › Assignment 037792/0969
Patent Assignment
Reel/Frame 037792/0969

Assignment of Assignor's Interest

Recorded: 2016-02-23 Pages: 6
Assignor
ATI TECHNOLOGIES ULC
Executed: 2016-02-12
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Properties (2)
Under Bump Routing Layer Method and Apparatus
Application: 11/949,951 →
Publication: US 2009/0032941
Conductor Bump Method and Apparatus
Patent: 8,294,266 →
Application: 13/027,076 →
Publication: US 2011/0133338
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 2007
From: MCLELLAN, NEIL; LI, YUE; TOPACIO, RODEN R.; CHEUNG, TERENCE
To: ATI TECHNOLOGIES ULC
Reel/Frame 020193/0197 →
Assignment of Assignor's Interest Feb 25, 2016
From: ADVANCED MICRO DEVICES INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 037828/0001 →
Amended and Restated U.S. Patent Security Agreement (for Non-U.S. Grantors) Aug 22, 2018
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS, INC.
Reel/Frame 046900/0136 →
Release of Security Interest Nov 10, 2020
From: CPPIB CREDIT INVESTMENTS INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 054372/0194 →
Assignment of Assignor's Interest Jul 29, 2021
From: MOSAID TECHNOLOGIES INC.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 057024/0919 →