Patent Assignment
Reel/Frame 037882/0691
Assignment of Assignor's Interest
Recorded: 2016-03-03
Pages: 7
Assignors
HERNER, SCOTT BRAD
Executed: 2015-01-22
ROMANO, LINDA
Executed: 2015-01-21
THOMPSON, DANIEL BRYCE
Executed: 2015-01-22
SCHUBERT, MARTIN
Executed: 2015-01-29
Assignee
GLO AB
SCHEELEVÄGEN 22, LUND, SE-223 63, SWEDEN
Covered Properties
(2)
Method of Stress Induced Cleaving of Semiconductor Devices
Method of Stress Induced Cleaving of Semiconductor Devices
Application:
61/907,487 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Ip Security Agreement
Dec 12, 2018
From: GLO AB
To: HERCULES CAPITAL, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 049042/0527 →
Security Interest
Jan 23, 2019
From: GLO AB
To: HERCULES CAPITAL INC.
Reel/Frame 048110/0063 →
Release of Security Interest
Apr 12, 2021
From: HERCULES CAPITAL, INC.
To: GLO AB
Reel/Frame 057210/0690 →
Nunc Pro Tunc Assignment
Aug 13, 2021
From: GLO AB
To: NANOSYS, INC.
Reel/Frame 057184/0564 →
Security Interest
Apr 1, 2022
From: NANOSYS, INC.
To: FORTRESS CREDIT CORP., AS AGENT
Reel/Frame 059569/0840 →
Termination and Release of Patent Security Agreement Recorded at Reel 059569 / Frame 0840
Sep 7, 2023
From: FORTRESS CREDIT CORP.,
To: NANOSYS, INC.
Reel/Frame 064836/0263 →
Change of Name
Oct 5, 2023
From: NANOSYS, INC.
To: SYSONAN, INC.
Reel/Frame 065156/0416 →
Assignment of Assignor's Interest
Oct 6, 2023
From: SYSONAN, INC.
To: GLO TECHNOLOGIES LLC
Reel/Frame 065178/0210 →
Assignment of Assignor's Interest
Jul 12, 2024
From: GLO TECHNOLOGIES LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 068297/0220 →